三月十五至十七日,「電子設備完整解決方案展」在台北國際展覽館舉辦。微矽技術實驗室有參展,展出玻璃和膜基板。所展示的玻璃有玻璃鑽孔、薄膜上的玻璃圖案剪裁和玻璃切割等加工工藝。膜基板方面,展示聚酰亞胺線路板和LCP高黏附力線路板。聚酰亞胺脂基板特點是畫上圖案時容易堆疊。而LCP基板則通常黏附性不好,但微矽技術實驗室展示的高黏附力和嵌入式接線處理,其他廠商可能難以比擬。如欲了解更多詳情,歡迎聯繫微矽技術實驗室。Generated by OpenAI
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三月十五至十七日,「電子設備完整解決方案展」在台北國際展覽館舉辦。微矽技術實驗室有參展,展出玻璃和膜基板。所展示的玻璃有玻璃鑽孔、薄膜上的玻璃圖案剪裁和玻璃切割等加工工藝。膜基板方面,展示聚酰亞胺線路板和LCP高黏附力線路板。聚酰亞胺脂基板特點是畫上圖案時容易堆疊。而LCP基板則通常黏附性不好,但微矽技術實驗室展示的高黏附力和嵌入式接線處理,其他廠商可能難以比擬。如欲了解更多詳情,歡迎聯繫微矽技術實驗室。Generated by OpenAI
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